ECE4808 · Microsystems and semiconductor fabrication

Overview

The unit addresses the foundation and practical aspects of semiconductor devices, micro sensors, micro actuators and related microtechnologies. Topics include an in-depth exploration of principles and materials relevant to MEMS and semiconductor devices, electrical and mechanical characterisation, foundational MEMS structures such as cantilever beams, comb structures and semiconductor device patterns for diodes, transistors and CMOS integrated circuits. Microfabrication techniques for semiconductor and MEMS devices, such as photolithography, etching deposition and other essential techniques are covered. Furthermore, the unit encompasses characterisation techniques for mechanical and electrical studies, assembly, packaging, testing, reliability and environmental impact studies. It involves hands-on laboratory exercises, project work, computer-based simulation and the construction of semiconductor/MEMS devices for potential real-world applications.

Areas of study: Minor: Intelligent manufacturing Minor: Semiconductor

Offerings

Assessment

The Handbook lists an examination for this unit.

Continuous assessment: 50% Final assessment: 50% This unit contains hurdle requirements that you must achieve to be able to pass the unit. You are required to achieve at least 45% in the total continuous assessment component and at least 45% in the final assessment component. The consequence of not achieving a hurdle requirement is a fail grade (NH) and a maximum mark of 45 for the unit.

Assessment details may change. Please refer to the assessment information in Moodle closer to the start of the teaching period.

Requisites

Learning outcomes

1. Explain the principles, instrumentation, microfabrication process, packaging, assembly techniques and materials associated with micro-electro-mechanical systems (MEMS) and semiconductor-based devices.
2. Create simulation models for MEMS and semiconductor devices, packaging and assembly of integrated circuits.
3. Design microsystems emphasising the foundation structures for microsensors and actuators, diodes, transistors, CMOS integrated circuits and analyse their mechanical and electrical characteristics, reliability and stability under typical environmental conditions.
4. Propose research ideas to advance the areas of microsystem technologies.
5. Engage in teamwork to carry out microfabrication and characterisation while manufacturing microdevices.

Workload

The minimum total expected workload to achieve the learning outcomes for this unit is 144 hours per semester typically comprising a mixture of 3-6 hours of scheduled learning activities and 6-9 hours of independent study per week. Scheduled activities may include a combination of teacher-directed learning, peer-directed learning and online engagement. Independent study may include associated readings, assessment and preparation for scheduled activities.

Student experience, not official rules. Nothing here changes what the Handbook says.