Units / ECE4831
ECE4831 · Microsystem packaging, assembly and testing
2026 Handbook6 credit pointsLevel 4Department of Electrical and Computer Systems Engineering
Last checked: 23 Aug 2026 UTCOverview
This unit cover all kinds of packaging from traditional techniques such as leaded and leadless packages, surface mount technology (SMT), and ball grid array (BGA) to advanced packaging techniques including: 2.5D and 3D packaging, Optoelectronics packaging, MEMS and Sensors packaging, Memory packaging. You will also explore practical and theoretical aspects in wire bonding, die bonding, wafer bonding, dicing, assembly. You will also be exposed to detailed concepts related to reliability study, electric shielding, electrostatic discharge, thermal management, failure analysis due to environmental conditions.
Areas of study: E2000 Bachelor of Technology Minor: Semiconductor
Offerings
The Handbook publishes no offerings for this unit.
Assessment
The Handbook lists an examination for this unit.
| # | Assessment | Type | Weight | Hurdle |
|---|---|---|---|---|
| 1 | Assignments | Project | 20% | — |
| 2 | Lab and presentation | Demonstration | 20% | — |
| 3 | Tests and quizzes | Examination | 10% | — |
| 4 | Final examination | Examination | 50% | — |
Continuous assessment: 50% Final assessment: 50%
Assessment details may change. Please refer to the assessment information in Moodle closer to the start of the teaching period.
Requisites
prohibitions
- ECE5831 — Microsystem packaging, assembly and testing
Learning outcomes
- Compare different traditional and advanced packaging technologies such as surface mount, ball grid array, 2.5D and 3D packaging employed in the semiconductor industry.
- Demonstrate dicing of wafer and wire bonding die to printed circuit board.
- Interpret challenges and failures in packaging, assembly, reliability of chip and communicate with semiconductor backend experts.
- Analyse reliability of given integrated circuit chips and work in a team to prepare a data sheet detailing the results.
Workload
The minimum total expected workload to achieve the learning outcomes for this unit is 144 hours per semester typically comprising a mixture of 3-6 hours of scheduled learning activities and 6-9 hours of independent study per week. Scheduled activities may include a combination of teacher-directed learning, peer-directed learning and online engagement. Independent study may include associated readings, assessment and preparation for scheduled activities.
Ask about ECE4831
Answered from the Handbook fields above — no AI, no guessing. Every answer links back to the source.
Community discussions about ECE4831
CommunityStudent experience, not official rules. Nothing here changes what the Handbook says.